A German–Israeli research team led by Dr. Andreas Furchner has demonstrated how imaging ellipsometry enables non-destructive characterization and quality control of microstructured MXene thin films during device fabrication. The authors used two complementary ellipsometry approaches for precise, multi-scale access to key material properties. The work positions imaging ellipsometry as a powerful platform for monitoring thin-film uniformity, device integrity, and functionality throughout processing, including critical lithographic steps. The study was published in Applied Physics Letters and selected as an Editor's Pick.